Dantec Dynamics announces the release of their new Thermoelastic Stress Analysis (TSA) portfolio

Thermoelastic Stress Analysis (TSA) is an imaging technique which provides a high-fidelity measurement of stress in objects under cyclic, elastic loading. TSA employs a thermal imaging sensor with an advanced image processing algorithm to convert thermo-elastically induced temperature changes from the measurement into an image of surface stress. The technique has a long history of successful use in Aerospace Testing, particularly in identifying and quantifying stress concentrations in geometrically complex & safety-critical structures.

TSA relies on a coupling between volumetric deformation and a reversible change in temperature, called the thermoelastic effect. This means, during elastic deformation, a solid will increase in temperature when in compression and decrease in temperature when in tension. As such, the change in temperature is directly proportional to change in stress.

Want to know more? Read the full article here.

Dantec Dynamics is very excited to be attending the Aerospace Test & Development Show 2024 for the 1st time, where we will be showcasing our new TSA product (the ThermoESA sensor) together with our MulticamDIC system.

Please come and visit us at Booth 824. We are looking forward to seeing you there!


By Dantec Dynamics